6W T10 COB Canbus LED Auto Light

Packaging & Delivery
Specifications
 
What is the COB LED? 
COB is the abbreviation of Chip-On-Board, COB is a new developing trend and special led package technique of LED. This LED packing method bind LED chips directly on the PCB board, so the heat from chip can be spread our through aluminum layer(PCB board) rapidly. The LED light source used in the LED lights and lightings which is made by this COB technique we usually call it FLM LED(full lighting module LED)
 
With this technology, the LED chips are in the form of a semiconductor chip, which is neither encased nor connected. The semiconductor chip is described as a "Die". This LED chip is processed by means of a special procedure which is called "Die Bonding". Here the individual chips are placed on the PCB and using the Wire Bonding method, connected to the contact surface of the PCB, which are described as "Pads". Gold wires in the micrometer range are used for contacting. The COB LED light technology allows for virtually limitless freedom of scope for the PCBs and thus serves as the basis for totally unique LED solutions.
 
The advantage of COB LED:
·         LED chip is fixed on the aluminum layer of aluminium base PCB. The heat from chip can be spread our through aluminum layer rapidly.
·         Low lighting decay, decay less than 3% after 5000 hours.
·         Equable and soft irradiancy, no glaring and eye protection due to the area illumination..
·         Good reliability. No dead bulb and no motting.
·         LED full lighting modules (FLM)can be combined into different led lights easily.
·         Highly Color-rendering index and lighting effect.
·         Safty, Enviroment friendly.  
·         Simple thermal management:
·         A metal core printed circuit board is used in the package to provide a low thermal resistance, allowing heat generated by the LED chip to be transferred to the heat sink via the shortest possible thermal path, which increases the life span, the heat transfers more efficiently through three layers than through five. The chip-on-board packages are mounted directly onto the back metal (with thermal compound at the interface), so that the heat generated by the LED chips spreads efficiently on the large metal frame for efficient dissipation without additional heat sinking. In the demonstration configuration, the entire backlight unit can maintain a temperature below 60°.( In comparison with the conventional approach, the thermal path is reduced. (DA = die attach, MCPCB = metal core printed circuit board.))